Solder paste used in SMD soldering. Suitable for both automatic soldering and manual printers, it boasts excellent adhesion for up to 24 hours after application. Thanks to its unique properties, this paste minimizes mid-chip solderballing, enabling the creation of high-quality mechanical and electrical connections. The product is designed to prevent moisture condensation, which can be achieved by bringing the paste to ambient temperature before opening, ensuring its properties remain optimal. The paste utilizes No Clean flux technology, eliminating the need for washing. Residues left after soldering with the paste are minimal, colorless, and non-corrosive, significantly simplifying the testing process.
Manufacturer AG TermoPasty Grzegorz Gąsowski Kolejowa 33E 18-218 Sokoły Poland info@termopasty.pl
Responsible person AG TermoPasty Grzegorz Gąsowski Kolejowa 33E 18-218 Sokoły Poland info@termopasty.pl
Easy Print Sn62 Pb36 Ag2 solder paste is a high-quality SMD surface mount product characterized by high precision, long shelf life and minimal soldering residues. AG Termopasty ART.AGT-023
Easy Print Sn62 Pb36 Ag2 solder paste is a high-quality SMD surface mount product characterized by high precision, long shelf life and minimal soldering residues. AG Termopasty ART.AGT-024
No product available!
Easy Print Sn62 Pb36 Ag2 solder paste is a high-quality SMD surface mount product characterized by high precision, long shelf life and minimal soldering residues. AG Termopasty ART.AGT-025
No-Clean soldering paste for SMD components, containing a resin- and solvent-based flux and thixotropic additives, retains its physical and chemical properties for 20 hours on PCBs. It is chloride-free, and the flux residue is non-corrosive and requires no cleaning, ensuring good mechanical and electrical properties for soldered joints. ART.AGT-031
No product available!
No Clean paste for soldering SMD components, containing a resin and solvent-based flux and thixotropic additives, retains its physicochemical properties for 20 hours on a PCB board, does not contain chlorides, and the flux residue does not corrode and does not require washing, ensuring good properties of soldered joints mechanical and electrical. ART.AGT-027
No product available!
Solder paste used in the SMD soldering process. It is suitable for both automatic soldering and manual printers. ThermoPasts ART.AGT-028
Solder paste used in the SMD soldering process. Suitable for both automatic soldering and manual printers. ART.AGT-026 Thermo Paste
No product available!
Solder paste used in the SMD soldering process. It is suitable for both automatic soldering and manual printers. ThermoPasts ART.AGT-032
No product available!
Solder paste used in the SMD soldering process. It is suitable for both automatic soldering and manual printers. ThermoPasts ART.AGT-030
Solder paste used in the SMD soldering process. It is suitable for both automatic soldering and manual printers. ThermoPasts ART.AGT-029
Lead-free solder paste ALPHA OM-338-CSP, no-clean type, based on SAC305 alloy, intended for SMT printing and assembly, is distinguished by high joint quality, resistance to solder ball and void formation, and compliance with IPC Class III standards. Ideal for manufacturing high-reliability devices.
This paste is an ideal choice for applications where reliable and effective soldering is required, exceeding the capabilities of traditional rosin.
No product available!
Solder paste used in the SMD soldering process. Suitable for both automatic soldering and manual printers. ART.AGT-026 Thermo Paste