Alpha OM-338-CSP SAC305 solder paste
ID: 1184272
5902186305564
zł399.91
Tax included
zł325.13 tax excl.
Lead-free solder paste ALPHA OM-338-CSP, no-clean type, based on SAC305 alloy, intended for SMT printing and assembly, is distinguished by high joint quality, resistance to solder ball and void formation, and compliance with IPC Class III standards. Ideal for manufacturing high-reliability devices.
Description
ALPHA OM-338-CSP is a lead-free, no-clean solder paste designed for a wide range of surface-mount technology (SMT) applications. It features excellent printability, high repeatability for very fine components, and a wide reflow process window. The paste formulation ensures good wetting on various surfaces, low solder ball formation, and compliance with IPC Class III standards for voids in the solder joint. With low residue levels and clean, aesthetic joints after soldering, it is well-suited for high-reliability applications.
Properties
- Alloy composition: SAC305 (96.5%Sn / 3.0%Ag / 0.5%Cu)
- Powder type: 4.5
- Flux residue: approx. 5% (by weight)
- Stencil thickness range: 0.100–0.150 mm
- Recommended print speed: 25–150 mm/s
- Maximum solder dot diameter: up to 2 cm
- Storage temperature range: 0–10 °C
- Stencil life: >8 hours (50% RH, 23 °C)
- Electrical resistance: >1.9 × 10¹⁰ Ω (IPC), 8.3 × 10¹² Ω (Bellcore)
- IPC classification: ROL0
- Flux color after reflow: transparent
- Packaging: 500 g jar
1184272
Manufacturer BTC Korporacja sp. z o. o. Lwowska 5 05-120 Legionowo Poland sprzedaz@kamami.pl 22 767 36 20
Responsible person BTC Korporacja sp. z o. o. Lwowska 5 05-120 Legionowo Poland sprzedaz@kamami.pl 22 767 36 20
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