Easy Print Sn96.5Ag3Cu0.5 solder paste 250 g plastic box
ID: 584390
5901764329411
zł227.49
Tax included
zł184.95 tax excl.
No Clean paste for soldering SMD components, containing a resin and solvent-based flux and thixotropic additives, retains its physicochemical properties for 20 hours on a PCB board, does not contain chlorides, and the flux residue does not corrode and does not require washing, ensuring good properties of soldered joints mechanical and electrical. ART.AGT-031
Description
No Clean paste intended for soldering SMD components in processes that do not include washing phases. In addition to metal powder, the product contains a flux based on resin and solvent, oxide-removing activators and thixotropic additives responsible for viscosity and plasticity. The paste does not lose its physicochemical properties even after 20 hours of being left on the PCB. This time depends on the conditions in the room: humidity and temperature.
Additional properties
- does not contain chlorides
- the flux residue does not corrode and does not require washing
- soldered connections have good mechanical and electrical properties
584390
Responsible person AG TermoPasty Grzegorz Gąsowski Kolejowa 33E 18-218 Sokoły Poland info@termopasty.pl
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