Wio-E5-LE Wireless Module (Tape Reel) – communication module with STM32WLE5JC and LoRaWAN EU868/US915 - Seeed Studio 114993121

Description

The Wio-E5-LE Wireless module is based on the STM32WLE5JC chip with an ARM Cortex-M4 core and an integrated SX126x transceiver. Designed for applications requiring very low power consumption, it features 76% lower transmit current compared to the standard Wio-E5 module, reaching only 26 mA at 14 dBm output power. With a compact package and Stamp Hole pads, the module can be easily integrated into a main board without the need for additional components.

It supports LoRa, (G)FSK, (G)MSK, and BPSK modulation as well as LoRaWAN class A, B, and C protocols. Operating in multiple frequency bands (EU868, US915, AU915, AS923, KR920, IN865), it ensures compatibility with popular LoRaWAN servers such as TheThingsStack and Chirpstack. The ready-to-use firmware with AT commands enables rapid IoT deployment, while the available SDK allows for developing custom applications. Low harmonic interference emission and compliance with CE and FCC standards accelerate the certification process of finished devices.

Properties

• Microcontroller STM32WLE5JC with ARM Cortex-M4 core
• SX126x transceiver with support for LoRa and (G)FSK
• Support for LoRaWAN class A/B/C
• Support for bands: EU868, US915, AU915, AS923, KR920, IN865
• Maximum transmit power 14 dBm at 868/915 MHz
• Sensitivity up to -137 dBm (SF12, 125 kHz)
• Transmit current: 26 mA
• Receive current: 6.7 mA
• Sleep current: 2.1 µA (active watchdog)
• Interfaces: 3× UART, SPI, I2C, ADC (12-bit, 1 Msps), NRST
• RF connector: RFIO
• Supply voltage range: 3.3 V
• Operating temperature range: from -40°C to +85°C
• Package: 28-pin, SMT, Stamp Hole (12 × 12 × 2.5 mm)
• Certificates: CE, FCC
• Version: Tape Reel (for automatic SMT assembly)