zł34.27 tax excl.
TIP TINNER TSLF+ is an indispensable product for anyone working with soldering, offering a quick and effective solution to problems with oxidized tips. Thanks to its advanced formula and compliance with current standards, it is a high-class product that will significantly improve the efficiency and quality of soldered joints.
TIP TINNER TSLF+ is an advanced product for cleaning, maintaining and re-whitening soldering tip tips. Designed for tips that have lost their protective bonding layer and cannot be refreshed using standard methods. The preparation based on lead-free Sn96.3Ag3.7 powder with the addition of thermally stable oxide-reducing compounds is an ideal solution to regain effective heat flow during soldering.
TIP TINNER TSLF+ is ideal for electronics professionals where precise soldering and maintaining the technical condition of soldering tips is crucial. Perfect for repair services, R&D laboratories and electronics production.
Data sheet
Manufacturer CYNEL-UNIPRESS SPÓŁKA Z OGRANICZONĄ ODPOWIEDZIALNOŚCIĄ Białołęcka 231 B 03-253 Warszawa Poland cynel@cynel.com.pl
Responsible person CYNEL-UNIPRESS SPÓŁKA Z OGRANICZONĄ ODPOWIEDZIALNOŚCIĄ Białołęcka 231 B 03-253 Warszawa Poland formularz kontaktowy na stronie osoby odpowiedzialnej
Foam and liquid for plastic are a guarantee of keeping all plastic elements clean. AG Termopasty ART.AGT-187
Foam and glass cleaner are reliable because they help get rid of stubborn dirt without leaving streaks. AG Termopasty ART.AGT-189
Foam and glass cleaner are reliable because they help get rid of stubborn dirt without leaving streaks. AG Termopasty ART.AGT-167
Foam and liquid for plastic are a guarantee of keeping all plastic elements clean. AG Termopasty ART.AGT-168
A microfiber cleaning cloth is extremely useful because it allows you to take care of the aesthetic appearance and functionality of electronic equipment. AG Termopasty ART.AGT-184
The set contains antistatic, bactericidal liquid, a microfiber cloth and a keyboard stick. Perfectly cleans LCD / TFT displays on laptops, palmtops, satellite navigation, monitors, keyboards. AG Termopasty ART.AGT-183
PR contact for removing debris during operation of devices. AG Termopasty ART.AGT-007
PR contact for removing debris during operation of devices. AG Termopasty ART.AGT-008
PRF 6-68 is a specialized cleaning spray with a 520 ml capacity, designed for removing oxides, sulfides, and greasy contaminants from electrical and electronic contacts. Particularly recommended for corroded connections, it restores low contact resistance and minimizes voltage drops, ensuring reliable device operation.
Plastic Surface Cleaner Foam 400ml - ART.008
Antistatic foam with silver nanoparticles designed for cleaning LED, OLED, LCD, CRT and plasma screens. MICRO CHIP ELEKTRONIC ART.010
Antistatic, bactericidal foam with active surfactant particles, removing impurities from all kinds of TFT liquid crystal displays. MICRO CHIP ELEKTRONIC ART. 013
Very well removes heavy dirt, fingerprints, dust, dirt streaks, nicotine deposits. Protects against harmful electrostatic charges by coating the cleaned items with an anti-static coating. MICRO CHIP ELEKTRONIC ART. 024
Very well removes heavy dirt, fingerprints, dust, dirt streaks, nicotine deposits. Protects against harmful electrostatic charges by coating the cleaned items with an anti-static coating. MICRO CHIP ELEKTRONIC ART.025
Very well removes heavy dirt, fingerprints, dust, dirt streaks, nicotine deposits. Protects against harmful electrostatic charges by coating the cleaned items with an anti-static coating. MICRO CHIP ELEKTRONIC ART.034
Solvent HIPS is a preparation for dissolving supporting structures made of HIPS filament used in 3D printing, used in metal containers or ultrasonic baths, with a dissolution time of 1 to 24 hours, which does not require heating. MICRO CHIP ELEKTRONIC MCP. ART. 044
TIP TINNER TSLF+ is an indispensable product for anyone working with soldering, offering a quick and effective solution to problems with oxidized tips. Thanks to its advanced formula and compliance with current standards, it is a high-class product that will significantly improve the efficiency and quality of soldered joints.