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New products
New products New products
Handbook of Silicon Based MEMS Materials and Technologies
A comprehensive guide to MEMS materials, and manufacturing, examining the state of the art with a particular emphasis on current and future applications.
Key topics covered include:
- Silicon as MEMS material
- Material properties and measurement techniques
- Analytical methods used in materials characterization
- Modeling in MEMS
- Measuring MEMS
- Micromachining technologies in MEMS
- Encapsulation of MEMS components
- Emerging process technologies, including ALD and porous silicon
Written by 73 world class MEMS contributors from around the globe, a volume of micromachining, the implementation of design processes. It also provides a comprehensive reference for R & D and academic communities.
- Veikko Lindroos is Professor of Physical Metallurgy and Materials at Helsinki University of Technology, Finland.
- Markku Tilli is Senior Vice President of Research at Okmetic, Vantaa, Finland.
- Ari Lehto is Professor of Silicon Technology at Helsinki University of Technology, Finland.
- Teruaki Motooka is Professor at the Department of Materials Science and Engineering, Kyushu University, Japan.
. Provides vital packaging technologies and process for silicon direct bonding, anodic bonding, glass frit bonding, and related techniques
. Shows how to protect your organization and the costs
. Discusses properties, preparation, and growth of silicon crystals and wafers
. Explains the many properties (mechanical, electrostatic, optical, etc.), manufacturing, processing, measuring (incl. Focused beam techniques), and multiscale modeling methods of MEMS structures
Silicon as MEMS Material; Modeling in MEMS; Measuring MEMS; Micromachining Technologies in MEMS; Encapsulation of MEMS Components
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Arduino Yun Mini is a breadboard PCB developed with ATmega 32u4 MCU and QCA MIPS 24K SoC CPU operating up to 400 MHz. Qualcomm Atheros CPU supports a Linux distribution based on OpenWRT named Linino. The board has built- in WiFi, supports 20 digital input/output pins, a 16 MHz crystal oscillator, a micro USB connector, an ICSP header, two reset buttons and one user button.
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The SparkFun Qwiic Shield for Thing Plus provides an easy-to-assemble way to add the SparkFun Qwiic ecosystem to any development board with the Thing Plus Footprint. It connects the I2C bus (GND, 3.3V, SDA, and SCL) on your Thing Plus to four SparkFun Qwiic connectors. Sparkfun DEV-16138
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OLED display with a diagonal of 0.91" and a resolution of 128x32 pixels. It is equipped with Qwiic connectors and communicates via the I2C interface. SparkFun LCD-17153
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Andrew Vladimirov, Konstantin V. Gavrilenko, Andrei A. Mikhailovsky
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