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Adam Bajera, Ryszard Kisiel
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About the book
The script acquaints the reader with the principles of the organization of the manufacturing process, with the subject of design and construction of electronic devices and the construction of selected electronic components. Various techniques of assembly of modern electronic devices and systems as well as issues related to heat exchange in devices have been discussed.
Table of Contents
Preface
Admission
1. PROBLEMS OF CONSTRUCTION OF ELECTRONIC DEVICES
1.1. Industrial implementation process
1.2. Constructional characteristics of electronic devices
1.3. Functional and operational features of the EU
1.4. Main environmental exposures and their impact on devices, components and electronic components
1.5. Environmental research, climate category
1.6. Environmental exposure teams
2. RELIABILITY OF ELECTRONIC DEVICES
2.1. Definition and measures of reliability
2.2. Reliability of basic structures
2.3. Actual reliability characteristics
3. MODULAR APPLIANCES. CONCEPT OF MODULAR DIVISION AND LEVELS OF INSTALLATION
3.1. microcircuits
3.2. Basic modules
3.3. Block
3.4. Block team. Stands and wardrobes. System
3.5. Unification and normalization of structures
4. ELECTRICAL CONNECTIONS IN ELECTRONIC APPLIANCES
4.1. Cables, properties and basic types
4.2. Wiring and its structural solution
4.3. Connection of electronic components
5. BASIC MODULES
5.1. Features of modules
5.2. Factors determining the dimensions of the module
5.3. Assembly of electronic and electromechanical components
5.4. Module constructions
6. PRINTED CIRCUITS
6.1. Types of printed circuits
6.2. Ways of mounting printed circuits
6.3. Principles of designing printed circuits
7. COOLING OF ELECTRONIC DEVICES
7.1. Heat transfer in electronic devices
7.2. Methods for increasing the heat exchange intensity
8. BASIC TECHNICAL PARAMETERS OF SELECTED ELECTRONIC ELEMENTS
8.1. A normalized series of nominal values
8.2. Resistors
8.3. capacitors
8.4. Basic induction components
8.5. Semiconductor devices
9. EXAMPLE PROBLEMS FOR SOLUTION
Literature
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ROSA3D filament made of high-quality PLA granules. 0.8 kg of filament with a diameter of 1.75 mm is wound on the spool. ROSA3D PLA Starter Navy Blue Transparent
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Adam Bajera, Ryszard Kisiel