- Out-of-Stock

This 3.25" x 2.125" breadboard has four bus lines spanning the length of the board and 30 rows of pins, enough for up to four 14-pin DIP ICs or three 16-pin DIP ICs. The rows and columns of tie points are conveniently labeled, and multiple units can be connected for larger projects.
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An adhesive backing secures the 270-point breadboard to your project. |
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Solderless breadboards are commonly used for prototyping because they allow you to quickly build temporary circuits without soldering. Breadboards accept most through-hole parts and up to #22 wire. When you’re done or want to change your circuit, it’s easy to take your circuit apart. For best results, use solid wires when breadboarding; you’ll find pre-cut jumper wire kits and premium jumper wires especially convenient.
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Dimension diagram (in mm) of the 270-point breadboard. |
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830-Point Breadboard |
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0.100" (2.54 mm) Breakaway Male Header: 1x40-Pin, Straight |
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350-Piece Wire Kit with Adjustable Case |
Responsible person BTC Korporacja sp. z o. o. Lwowska 5 05-120 Legionowo Poland sprzedaz@kamami.pl 22 767 36 20
No product available!
No product available!
The set contains 350 pcs of colored 22 AWG connecting wires of various lengths, designed to connect contact areas. WJW-60B
The set contains 140 pieces of colored 22 AWG connecting wires of various lengths, designed to connect contact areas. WJW-70B
No product available!
No product available!
No product available!
ROSA3D filament made of high-quality PLA-Silk granules characterized by intense color and exceptional gloss. 0.8 kg of filament with a diameter of 1.75 mm is wound on the spool. Filament ROSA3D PLA-Silk Fuchsia
No product available!
No product available!
No product available!
RTL8211E-VL-CG, Integrated 10/100/1000 Gigabit Ethernet Transceiver, QFN-48
No product available!
DevKit8000 Evaluation Kit (dual-core OMAP3530: ARM Cortex-A8 and DSP C64xx) with 7-inch TFT
No product available!
No product available!
High quality XF-ABS filament for 3D printer with 3 mm diameter. 2 kg of wire are wound on the spool.
No product available!
Assembled electromagnetic lock controller. AVT1919 C
No product available!
No product available!
No product available!
No product available!
No product available!
ARM7TDMI, 512kB Flash (ISP), 64kB RAM, 2xCAN, Ethernet 10/100, USB, DMA, I2S, 3xI2C, SPI/SSP, 4xUART, ADC, DAC, LQFP100, RoHS
No product available!
BGA balls with a diameter of 0.3 mm and composition Sn63 / Pb37. The ampoule contains 10,000 pieces.
No product available!
No product available!