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Lead-free tin by Cynel with flux on a spool of 100 g, diameter 0.25 mm. Sn99Cu0.7Ag0.3 alloy produced from the purest raw materials in accordance with ISO EN 9453:2014.
The binder is intended for manual and mechanized soldering in electronics, electrical engineering and other branches where compliance with the RoHS2 directive is required.
Chemical characteristic
| Pb | Sb | Bi | Cu | Au | In | Ag | Al | As | Cd | Fe | Ni | Zn |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 0,07 | 0,1 | 0,006 | 0,9 | 0,005 | 0,1 | 0,4 | 0,001 | 0,03 | 0,002 | 0,02 | 0,01 | 0,001 |
Physical characteristics
Manufacturer CYNEL-UNIPRESS SPÓŁKA Z OGRANICZONĄ ODPOWIEDZIALNOŚCIĄ Białołęcka 231 B 03-253 Warszawa Poland cynel@cynel.com.pl
Responsible person CYNEL-UNIPRESS SPÓŁKA Z OGRANICZONĄ ODPOWIEDZIALNOŚCIĄ Białołęcka 231 B 03-253 Warszawa Poland formularz kontaktowy na stronie osoby odpowiedzialnej
Solder tape used to collect excess tin, 1 mm wide, 1.5 m long
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Tape, in the form of a braid, to remove the excess of molten solder brazing material during soldering and desoldering of electronic components 1.5m
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No product available!
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No product available!
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Lead-free tin Sn99Cu0.7Ag0.3 with EVO11 flux, 100 g spool, 0.25 mm diameter. Cynel SAC307-0.25/100