- Out-of-Stock
Heat Sink for Odroid-C0
ID: 561189
26 x 40mm Heat Sink with thermal interface material
Descritpion
This heatsink might be useful for who needs the full throttled quad-core performance with ODROID-C0.
The same heatsink is mounted on ODROID-C1+ by default.
ATTENTION!
If you remove the thin(white) thermal interface material(TIM), the heatsink might cause electric short to the PCB components!Must remove a thin transparent film underneath before mounting on the PCB.
Features
- Dimension: 26.0 x 40.0 x 10.0 mm (approx.)
- Thermal interface material (double-side tape) is assembled.
561189
Manufacturer BTC Korporacja sp. z o. o. Lwowska 5 05-120 Legionowo Poland sprzedaz@kamami.pl 22 767 36 20
Responsible person BTC Korporacja sp. z o. o. Lwowska 5 05-120 Legionowo Poland sprzedaz@kamami.pl 22 767 36 20
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26 x 40mm Heat Sink with thermal interface material