Thermopad 30x30x3.0 (6W/mK) AG

Silicone thermal grease used to improve the amount of heat transferred to, for example, the heat sink. The paste is resistant to oxidation and operating temperature in the range from -50 to 200 ° C. Paste in a syringe with a capacity of 25 g. AG Termopasty ART.AGT-056

Thermally conductive silicone paste H improve the heat flow between electronic components and the heatsink, guaranteeing their proper operation. AG Termopasty ART.AGT-057

Thermal paste with gold particles, designed to fill microscopic surface irregularities between components requiring efficient heat transfer, including processors, electronic components and heatsinks. Thermal conductivity is >3.57 W/mK, with an operating temperature range from -50°C to 250°C and short-term temperature resistance up to 340°C. The paste provides good dielectric properties and can also be used in industrial equipment and energy systems. The ART.AGT-106 variant is supplied in a syringe containing 3 g of paste. AG TermoPasty ART.AGT-106

The AG TermoGlue thermal adhesive is used to mount heat sinks on integrated circuits requiring cooling, and fills in unevenness to improve heat conduction. AG Termopasty ART.AGT-116