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Thermal glue AG TermoGlue 10g

The AG TermoGlue thermal adhesive is used to mount heat sinks on integrated circuits requiring cooling, and fills in unevenness to improve heat conduction. CHE1606

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ID: 551083

1,60€ gross (23% VAT)
1,30€ net

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Description

The AG TermoGlue thermal adhesive is used to mount heat sinks on integrated circuits requiring cooling, and fills in unevenness to improve heat conduction.

properties

  • Heat-conducting glue
  • White color
  • Thermal conductivity: 1 W / mK
  • Maximum working temperature: 200 ° C
  • Electrical puncture resistance: min. 20 kV / mm
  • Tensile strength: 2 MPa
  • Dielectric constant: 3
  • Drying time: 8 minutes
  • Weight: 10 g (net)

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