MYC-AM3352 - SoM module with TI AM3352 processor

Description

MYC-AM3352 is an integrated, inexpensive, built-in SOM (System on Module) ARM system. It has been equipped with TI AM3352 processor with ARM Cortex-A8 core, 512 MB DDR3 SDRAM, 512 MB Nand Flash and Gigabit Ethernet PHY and interfaces supporting real time PRU / ICSS protocols, such as EtherCAT, PROFINET, EtherNet / IP, PROFIBUS, Ethernet Powerlink, Sercos and others. The module has two 60-pin male expansion connectors with a 2.0 mm pitch for connecting to the motherboard, thus providing an interface for the motherboard to carry most I / O signals to and from the CPU module. It is additionally equipped with a 26-pin connector with a 2.0 mm pitch and a 10-pin connector with 2.54 mm pitch. The module is ideally suited for embedded applications, such as automotive, control systems, lighting or processing.

MYC-AM3352 is the core of the development board MYD-AM3352 (not included), which is a fully functional evaluation platform for users creating applications with Linux.

properties

• processor
• TI AM3352 (15 x 15 mm, pitch 0.8 mm, housing ZCZ)
• ARM Cortex-A8 800 MHz RISC MPU (up to 1 GHz)
• SIMD NEON coprocessor
• 32 KB / 32 KB cache for L1 instruction with single error detection (parity)
• 256 KB L2 cache with error correction code (ECC)
• Programmable real time subsystem
• Memory
• 512 MB DDR3 SDRAM
• 512 MB Nand Flash
• Peripherals
• Built-in Gigabit Ethernet PHY
• Power indicator (red LED)
• User diode (green)
• Two 60-pin expansion connectors with 2.0 mm pitch:
• 2 OTG USB2.0 ports
• 6 x serial ports
• 2 x I2C
• 1 x SPI
• 7 x ADC
• 2 x PWM
• 3 x SDIO
• 26-pin extension interface with 2.0 mm pitch
• 10-pin extension interface with 2.54 mm pitch
• Operating system support
• Linux 3.2.0
• Android 4.2.2
• Windows CE7
• Mechanical parameters
• Power supply: 3.3 V / 0.8 A
• PCB layers: 6-layer construction
• Working temperature: 0 ... 70 degrees Celsius
• Dimensions: 70 x 50 mm

Block diagram of the module