Basics of technology for electronics

Author: Ryszard Kisiel

ISBN: 83-60233-09-8
Format: B5, 206 pages
Hardcover
BTC publishing house
Warsaw 2005

About the book

Manual-guidebook for constructors of electronic devices, focused primarily on the presentation of technologies and assembly techniques used in modern electronics. The author presents in an accessible way the most important technological problems occurring during the construction of devices and assembly of components (with particular reference to SMD elements) and available methods of preventing them. He also discussed the basic issues related to design optimized for testing (ICT with JTAG, X-ray, etc.), basic physico-chemical issues related to the use of lead-free materials, presented the details of processes related to the design of printed circuits in terms of different assembly technologies, also raised the subject repair operations at the stage of production of electronic devices.

About the author

Dr inż. Ryszard Kisiel works as an academic teacher at the Faculty of Electronics and Information Technology at Warsaw University of Technology. He obtained the title of Master of Science (1974) at the Faculty of Mechanical Engineering of the Warsaw University of Technology in the field of metal science. In 1983, he received the degree of doctor of technical sciences at the Faculty of Electronics of the Warsaw University of Technology in the field of electron technology. He is the author of over 70 scientific publications, of which 51 are in English. Their subject matter concerns assembly technology of electronic devices, lead-free solder, electrically conductive adhesives and thick and thin-film hybrid systems.
Since the early 1990s, he has been very active in popularizing knowledge of surface mount technology. He is the author or co-author of over 50 articles on this topic in the following magazines: Elektronika, Elektronizacja, Radioelektronik and Elektronika Praktyczna. He lectures for students of the Faculty of Electronics and Information Technology in the field of electronic equipment design and assembly technology. He is a co-author of two scripts and a supervisor of many engineering and master theses in this subject. Is a member of international technical associations: IEEE and IMAPS.

To download

• Table of contents in the format
• Introduction to the book in the format