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AG Silver is a thermally conductive paste enriched with silver compounds that increase the level of thermal conductivity. The product is also distinguished by its low thermal impedance. It is worth covering the micro-gaps between heat sinks and CPUs, GPUs or other components. AG Silver Paste is also useful for transferring heat from tube condensers to exchangers inside solar collectors. The usefulness of the preparation is confirmed by the RoHS standard, in accordance with which it was produced.
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Heat Grease Thermal Grease based on copper with a thermal conductivity of approx. 3.1 W / mK. AG Termopasty ART.AGT-060
Thermal paste with gold particles, designed to fill microscopic surface irregularities between components requiring efficient heat transfer, including processors, electronic components and heatsinks. Thermal conductivity is >3.57 W/mK, with an operating temperature range from -50°C to 250°C and short-term temperature resistance up to 340°C. The paste provides good dielectric properties and can also be used in industrial equipment and energy systems. The ART.AGT-106 variant is supplied in a syringe containing 3 g of paste. AG TermoPasty ART.AGT-106
AG Silver thermal grease with the addition of silver compounds with high thermal conductivity. A paste weighing 1g in a syringe. AG Termopasty ART.AGT-164
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AG Silver thermal grease with the addition of silver compounds with high thermal conductivity. 4g paste in a small bottle with a brush. AG Termopasty ART.AGT-124