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BGA balls with a diameter of 0.35 mm and composition Sn63 / Pb37. The ampoule contains 10,000 pieces.
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BGA balls with a diameter of 0.35 mm and Sn63 / Pb37 composition used during electronic circuit services. The ampoule contains 10,000 pieces.
Set of 10 universal BGA sieves for direct heating.
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No product available!
No product available!
No product available!
HK Turnigy TrackStar 10.5T Sensored Brushless Motor 3250KV (23361)
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No product available!
Kit with Raspberry Pi computer built into the keyboard. Equipped with a power supply, mouse, HDMI cable and 16 GB microSD card. Raspberry Pi 400 Personal Computer Kits UK
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No product available!
Wandboard Dual Freescale i.MX6 Cortex-A9 dual core processor Development Board, RAM 1 GB, Ethernet, HDMI, USB, Wi-Fi, Bluetooth RoHS
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No product available!
No product available!
No product available!
No product available!
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The sponge is indispensable at the time of soldering, it removes tin residues and stains from the tip. Dimensions 45x60mm
No product available!
BGA balls with a diameter of 0.35 mm and composition Sn63 / Pb37. The ampoule contains 10,000 pieces.