Category: Main categories

AG Thermopads without glue are used where it is not possible to use thermal paste. They are very flexible. They are characterized by high compressibility which ensures a good fit to elements that require cooling. They do not contain glue. AG Thermopaste ART.AGT-305

AG Thermopads without glue are used where it is not possible to use thermal paste. They are very flexible. They are characterized by high compressibility which ensures a good fit to elements that require cooling. They do not contain glue. AG Thermopaste ART.AGT-301

AG Thermopads without glue are used where it is not possible to use thermal paste. They are very flexible. They are characterized by high compressibility which ensures a good fit to elements that require cooling. They do not contain glue. AG Thermopaste ART.AGT-298

The DS3231 Real Time Clock (RTC) module with CR2032 battery is a precise and reliable I2C enabled component that provides time and date tracking, maintains accuracy when main power is disconnected, and offers alarm and wake-up functions with easy connectivity to various platforms such as such as Arduino, Raspberry Pi or STM32

Adapter for power supply with 5.5 x 2.1 mm input and 4.0 x 1.7 mm output

Bluetooth 2.1+EDR module for mounting in SMD technology with a fully configurable UART interface (transfer speed up to 2 Mb/s). SparkFun WRL-12575

7-segment LED display, 1 digit 13.20 mm, black background green (630nm), 10 ucd (10mA), common anode, red (630nm), 6 mcd (10mA), common anode. Pb-free. LED1-AS-B-05219BMRMG

The Nexys Video features several components that make it ideal for developing audio/video applications. The Artix-7 XC7A200T FPGA is the most powerful chip from Xilinx\'s Artix-7 family. A Mini DisplayPort source provides the board with a uni-directional, high-bandwidth, low-latency audio/video channel. (410-316)

AG Thermopads without glue are used where it is not possible to use thermal paste. They are very flexible. They are characterized by high compressibility which ensures a good fit to elements that require cooling. They do not contain glue. AG Thermopaste ART.AGT-295

AG Thermopads without glue are used where it is not possible to use thermal paste. They are very flexible. They are characterized by high compressibility which ensures a good fit to elements that require cooling. They do not contain glue. AG Thermopaste ART.AGT-292

Camera module with OV5647 sensor with a resolution of 5 MP and optical image stabilization. Works with all versions of the Raspberry Pi. Waveshare OV5647-70 5MP OIS Camera

RM500Q-AE module with M.2 connector. It supports 5G, 4G and 3G networks and supports GNSS positioning. Waveshare RM500Q-AE

Recognizes the distance of an object away from the sensor up to about 10 inches (~25cm) and the location of the object from side to side across the sensor in about a 6 inch (~15cm) span. You will be able to use I2C or UART to communicate with the ZX Sensor via an Arduino-based microcontroller as well as a computer. SEN-12780

TF grease is a formulation with Teflon and silicone. The right mix of the highest quality product ingredients and a wide range of operating temperatures (-40°C to 250°C) guarantee usability in all conditions. AG Termopasty ART.AGT-067

RM500Q-GL module with M.2 connector. It supports 5G, 4G and 3G networks and supports GNSS positioning. Waveshare RM500Q-GL

Graphite grease owes its usefulness to a carefully selected mixture of ingredients of the highest quality. AG Termopasty ART.AGT-175

RM502Q-AE module with M.2 connector. It supports 5G, 4G and 3G networks and supports GNSS positioning. Waveshare RM502Q-AE

SEN-14032

SIMCom 5G SIM8262E-M2 module with Qualcomm Snapdragon X62 chip. It supports 5G SA or NSA networks and is backward compatible with 4G and 3G networks. Waveshare SIM8262E-M2

Minicomputer with built-in NVIDIA Jetson Xavier NX module with 16 GB RAM. In aluminum housing, has JetPack installed. Seeed Studio 110061402