Main view
search
  • Main view
  • Top view (adapter closed)
  • Side view
  • Bottom view
  • Top view (adapter open)
  • Angled view (adapter closed)
  • Steep angled view (adapter open)
  • Angled view (adapter open)
ID: 1200363
5902186340329
zł349.00
Tax included

zł283.74 tax excl.

The XG-BGA63-0.8 adapter enables programming and testing of BGA63 chips with a 0.8 mm pitch using the XGecu T56 programmer. It supports package sizes from 9 × 11 mm to 13 × 10.5 mm, ensuring precise and reliable connections in service and laboratory applications.

4 weeks
Awaiting delivery

Description

The XG-BGA63-0.8 adapter is designed for handling BGA63 IC packages with a 0.8 mm pitch, compatible exclusively with the XGecu T56 programmer. It enables precise testing and programming of chips sized from 9 × 11 mm to 13 × 10.5 mm, including 11 × 10 mm. The adapter’s construction ensures stable mounting and accurate connection mapping, minimizing the risk of errors during operation. With heat resistance up to 105°C, it can also be used in demanding service conditions. Made of high-quality materials to ensure durability and reliability.

Properties

  • Adapter type: BGA63 → DIP48
  • Supported packages: BGA63
  • Chip sizes: 9 × 11 mm, 11 × 10 mm, 13 × 10.5 mm
  • Pitch: 0.8 mm
  • Compatibility: XGecu T56 programmer (not compatible with other models)
  • Heat resistance: up to 105°C
  • Material: high-quality durable plastics and metal
  • Application: testing and programming BGA63 chips
1200363

Manufacturer

  • BTC Korporacja sp. z o. o.
  • Ludwinowo Zegrzyńskie 52G
  • 05-140 Ludwinowo Zegrzyńskie
  • Poland
  • [email protected]
  • 22 767 36 20

Responsible person

  • BTC Korporacja sp. z o. o.
  • Ludwinowo Zegrzyńskie 52G
  • 05-140 Ludwinowo Zegrzyńskie
  • Poland
  • [email protected]
  • 22 767 36 20

Other products in the same category (16)