Contact IPA plus 1l, metal canister

Two-component silicone cross-linking filler in the addition system. The filler perfectly protects the electronics against unfavorable environmental factors and protects the sensitive modules against vibrations. AG Termopasty ART.AGT-222

Two-component silicone filler for filling or filling gaps in heat-generating electronic components with metal housings or heat sinks. AG Termopasty ART.AGT-219

Two-component silicone filler for filling or filling gaps in heat-generating electronic components with metal housings or heat sinks. AG Termopasty ART.AGT-201

Two-component silicone filler for filling or filling gaps in heat-generating electronic components with metal housings or heat sinks. AG Termopasty ART.AGT-220

Two-component silicone filler for filling or filling gaps in heat-generating electronic components with metal housings or heat sinks. AG Termopasty ART.AGT-221

AG Thermopads without glue are used where it is not possible to use thermal paste. They are very flexible. They are characterized by high compressibility which ensures a good fit to elements that require cooling. They do not contain glue. AG Thermopaste ART.AGT-306

Contact IPA Plus contains high purity isopropyl alcohol. Removes all contamination from optical elements. Leaves no traces or stains. AG Termopasty ART.AGT-267

Heat Grease Thermal Grease based on copper with a thermal conductivity of approx. 3.1 W / mK. AG Termopasty ART.AGT-061

Thermal paste AG Extreme thanks to the use of steel dust additive ensures the discharge of large amounts of heat from electronic components (processors, graphics cards, power systems). A paste weighing 1000g in a plastic box. AG Termopasty ART.AGT-150

Thermal paste AG Extreme thanks to the use of steel dust additive ensures the discharge of large amounts of heat from electronic components (processors, graphics cards, power systems). A paste weighing 100g in a plastic box. AG Termopasty ART.AGT-247

AG Gold is a thermal paste with the addition of gold. It is characterized by high thermal conductivity (>2.8 W/mK), which is up to three times higher than in the case of introducing products. AG Termopasty ART.AGT-119

The AG TermoGlue thermal adhesive is used to mount heat sinks on integrated circuits requiring cooling, and fills in unevenness to improve heat conduction. AG Termopasty ART.AGT-180

AG Silver thermal grease with the addition of silver compounds with high thermal conductivity. A paste weighing 1000 g in a plastic box. AG Termopasty ART.AGT-149

AG Silver thermal grease with the addition of silver compounds with high thermal conductivity. A paste weighing 100 g in a plastic box. AG Termopasty ART.AGT-118

Foam with a density of 0.99 g/cm3 and a slightly alkaline pH (7-8) helps to find any gas or air leaks. AG Termopasty ART.AGT-133

AG Thermopads without glue are used where it is not possible to use thermal paste. They are very flexible. They are characterized by high compressibility which ensures a good fit to elements that require cooling. They do not contain glue. AG Thermopaste ART.AGT-305