

zł9.96 tax excl.
Extruded aluminium heatsink dedicated to SoM produced by SoMLabs with optional bracket and fan. The maximum thermal resistance is 18.9K/W and maximum dissipation loss 3.9W
The SL-HEATSINK-50x20x10-A is the extruded aluminium heatsink with pins, dedicated to SoM produced by SoMLabs. For proper installation of the heatsink, a mounting bracket is required, available as a 3D (STL) model (the reference SODIM socket is 1473005-4).
If necessary, we recommend using a fan with dimensions 20x20x6 mm, for example YBL2006C05F or similar.
We recommend using a thermally conductive spacer AGT-306 (0.5mm, 6W/mK) between the heatsink and electronic components.
Manufacturer SOMLABS SPÓŁKA Z OGRANICZONĄ ODPOWIEDZIALNOŚCIĄ Lwowska 5 05-120 Legionowo Poland somlabs@somlabs.com
Responsible person SOMLABS SPÓŁKA Z OGRANICZONĄ ODPOWIEDZIALNOŚCIĄ Lwowska 5 05-120 Legionowo Poland somlabs@somlabs.com
AG Thermopads without glue are used where it is not possible to use thermal paste. They are very flexible. They are characterized by high compressibility which ensures a good fit to elements that require cooling. They do not contain glue. AG Thermopaste ART.AGT-306
YDM2006C05F micro fan with 5 VDC input and 20 x 20 x 6 mm dimensions, designed for efficient cooling of small electronic modules. Features low power consumption, quiet operation, and extended service life under continuous use
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Extruded aluminium heatsink dedicated to SoM produced by SoMLabs with optional bracket and fan. The maximum thermal resistance is 18.9K/W and maximum dissipation loss 3.9W