SL-HEATSINK-35x35x10-A is the extruded aluminium heatsink with pins, dedicated to SLC5 single board computer (TitanSBC-8Mmini). Plastic pins enable convenient mounting of the heat sink to the SBC board.
We recommend using a thermally conductive spacer AGT-160 30x30x2,0 mm or AGT-159 30x30x1,0 mm (both: 6W/mK) between the radiator and electronic components.

Heatsink performance chart is presented below.

Manufacturer
Responsible person
AG Double-sided adhesive, thermally conductive thermopads are used where it is not possible to use thermally conductive paste. They are very flexible. They are characterized by high compressibility which ensures a good fit to elements that require cooling. AG Termopasty ART.AGT-159
AG Double-sided adhesive, thermally conductive thermopads are used where it is not possible to use thermally conductive paste. They are very flexible. They are characterized by high compressibility which ensures a good fit to elements that require cooling. AG Termopasty ART.AGT-160
ARM Cortex-M3 CPU, Low power, 128kB Flash, 16kB RAM, USB, 3xUART, 2xI2C, 2xSPI, ADC, DAC, STM, LQFP100, RoHS
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The 4x4 Membrane Keyboard Module with 16 Buttons is compatible with Raspberry Pi, Arduino, AVR and other microcontrollers. It is lightweight, durable and easy to assemble, making it ideal for various electronics projects. ModKB4x4
ARM Cortex-M3 CPU, 256kB Flash, 24kB RAM, 2xUART, 3xUSART, 2xI2C, 3xSPI, CEC, ADC, DAC, STM, LQFP144, RoHS
Ultra-low-power ARM Cortex-M3 MCU with 256 Kbytes Flash, 32 MHz CPU, LCD, USB, 3xOp-amp, LQFP144, STM, RoHS
Ultra-low-power ARM Cortex-M3 MCU with 256 Kbytes Flash, 32 MHz CPU, LCD, USB, 3xOp-amp, LQFP144, STM, RoHS
MEMS motion sensor, dual axis pitch and yaw ±300°/s analog gyroscope, STM, LGA16L, RoHS
Temperature and Humidity Sensor, RoHS
Extruded aluminium heatsink with pins, dedicated to SLC5 single board computer (TitanSBC-8Mmini). Thermal resistance 15.2K/W, maximum dissipation loss 4.2W