SL-HEATSINK-35x35x10-A is the extruded aluminium heatsink with pins, dedicated to SLC5 single board computer (TitanSBC-8Mmini). Plastic pins enable convenient mounting of the heat sink to the SBC board.
We recommend using a thermally conductive spacer AGT-160 30x30x2,0 mm or AGT-159 30x30x1,0 mm (both: 6W/mK) between the radiator and electronic components.

Heatsink performance chart is presented below.

Manufacturer SOMLABS SPÓŁKA Z OGRANICZONĄ ODPOWIEDZIALNOŚCIĄ Lwowska 5 05-120 Legionowo Poland somlabs@somlabs.com
Responsible person SOMLABS SPÓŁKA Z OGRANICZONĄ ODPOWIEDZIALNOŚCIĄ Lwowska 5 05-120 Legionowo Poland somlabs@somlabs.com
AG Double-sided adhesive, thermally conductive thermopads are used where it is not possible to use thermally conductive paste. They are very flexible. They are characterized by high compressibility which ensures a good fit to elements that require cooling. AG Termopasty ART.AGT-159
AG Double-sided adhesive, thermally conductive thermopads are used where it is not possible to use thermally conductive paste. They are very flexible. They are characterized by high compressibility which ensures a good fit to elements that require cooling. AG Termopasty ART.AGT-160
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Extruded aluminium heatsink with pins, dedicated to SLC5 single board computer (TitanSBC-8Mmini). Thermal resistance 15.2K/W, maximum dissipation loss 4.2W