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The eMMC Flash memory module is designed for Hardkernel Odroid N2L computers with the Linux operating system installed. The module is equipped with a Flash memory with an eMMC interface (HS400, 8-bit DDR mode). The set includes a microSD adapter that allows reading/writing the module's memory through any device that supports microSD or SD/MMC cards (with an additional microSD adapter - SD).




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Lead-free tin Sn99Cu0.7Ag0.3 with EVO11 flux, 100 g spool, 0.25 mm diameter. Cynel SAC307-0.25/100
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The sponge is indispensable at the time of soldering, it removes tin residues and stains from the tip. Dimensions 45x60mm
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The ODROID-XU4 includes the cooling fan by default. You might need this part when you want to replace the original cooling fan
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Mini USB Bluetooth dongle compatible with ODROID-C1, C1+, C0, C2 and XU3, XU4
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It is a USB3.0 adapter for SATA3 HDD / SSD compatible with Odroid XU4, U3 and X2. Equipped with the ASM1051E ASMedia system. The set includes a 12 V / 2 A power supply and a USB3.0 cable. Manufacturer's name: USB3.0 to SATA3 HDD / SSD interface kit
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High quality XF-ABS filament for 3D printer with 1.75 mm diameter. 1 kg of wire is wound on the spool.
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High quality XF-ABS filament for 3D printer with 1.75 mm diameter. 1 kg of wire is wound on the spool.
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High quality XF-ABS filament for 3D printer with 1.75 mm diameter. 1 kg of wire is wound on the spool.
No product available!
High quality XF-ABS filament for 3D printer with 1.75 mm diameter. 1 kg of wire is wound on the spool.
No product available!
High quality XF-ABS filament for 3D printer with 1.75 mm diameter. 1 kg of wire is wound on the spool.
No product available!
High quality XF-ABS filament for 3D printer with 1.75 mm diameter. 1 kg of wire is wound on the spool.
No product available!
High quality XF-ABS filament for 3D printer with 1.75 mm diameter. 1 kg of wire is wound on the spool.
No product available!
High quality XF-ABS filament for 3D printer with 1.75 mm diameter. 1 kg of wire is wound on the spool.
No product available!
High quality XF-PLA filament for 3D printer with 1.75 mm diameter. 1 kg of wire is wound on the spool.
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High quality XF-PLA filament for 3D printer with 1.75 mm diameter. 1 kg of wire is wound on the spool.
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eMMC Flash memory module for Hardkernel Odroid N2L computers. 128GB capacity, installed Linux operating system. The set includes a microSD adapter. Hardkernel 128GB eMMC Module N2L Linux