Category: Main categories

Module with ToF VL53L4CD sensor with a range of up to 1.3 m and a resolution of 1 mm. It is equipped with a STEMMA QT connector and communicates via the I2C interface. Adafruit 5396

Wall mounting bracket for devices from the WebDAQ series. Digilent 6069-240-006

A holder for mounting on a DIN rail dedicated to devices from the BTH-1208LS, E-1608, E-DIO24, USB-200 and WebDAQ series. Digilent 6069-240-005

DAQ device based on Ethernet communication and equipped with 8 SE/4 DIFF analog inputs, two analog outputs, 8 digital inputs/outputs and one 32-bit counter. It offers 16-bit resolution and a sampling rate of 250 kS/s. Digilent 6069-410-016

DAQ device based on USB communication and equipped with 8 single-end analog inputs, two analog outputs, 8 digital I/O and one 32-bit counter. It offers 12-bit resolution and a sampling rate of 500 kS/s. Digilent 6069-410-009

DAQ device based on USB communication and equipped with 8 SE analog inputs, 8 digital inputs / outputs and one 32-bit counter. It offers 16-bit resolution and a sampling rate of 100 kS / s per channel. Digilent 6069-410-015

DAQ device based on USB communication and equipped with 8 analog SE / DIFF inputs, two analog outputs, 4 digital I/O, two counters and two inputs for encoder support. It offers 18-bit resolution and a sampling rate of 200 kS/s. Digilent 6069-410-014

HPX thermally conductive silicone paste that improves heat transfer between electronic components and the heat sink, guaranteeing their proper operation. They effectively prevent punctures and protect against weather influences. AG Termopasty ART.AGT-114

DAQ device based on USB communication and equipped with 8 analog SE/4 DIFF inputs, two analog outputs, 8 digital inputs/outputs and one 32-bit counter. It offers 16-bit resolution and a sampling rate of 100 kS/s. Digilent 6069-410-013

DAQ device based on USB communication and equipped with 8 analog SE/4 DIFF inputs, two analog outputs, 8 digital inputs/outputs and one 32-bit counter. It offers 16-bit resolution and a sampling rate of 50 kS/s. Digilent 6069-410-012

USB-based DAQ device with 16 single-ended or 8 differential analog inputs, two analog outputs, 8 digital I/O, and two counter inputs and one output. It offers 16-bit resolution and a sampling rate of 500 kS/s. Digilent 6069-410-011

USB-based DAQ device with 16 single-ended or 8 differential analog inputs, 8 digital I/O, and two counter inputs and one output. It offers 16-bit resolution and a sampling rate of 500 kS/s. Digilent 6069-410-010

A sensor that detects the oxygen concentration. Equipped with a factory calibrated probe. It communicates via the UART interface or the analog output. Seeed Studio 101020912

AG Thermopads without glue are used where it is not possible to use thermal paste. They are very flexible. They are characterized by high compressibility which ensures a good fit to elements that require cooling. They do not contain glue. AG Thermopaste ART.AGT-293

Raspberry Pi Pico W soldered board module dedicated to matrix displays with HUB75 interface. Pimoroni PIM662

Development board containing the STM32H743XI microcontroller, 5MP OV5640 camera module, FLIR Lepton socket and the VL53L0X laser rangefinder. Also equipped with a 4.3 "LCD display. SparkFun DEV-18482

AG Double-sided adhesive, thermally conductive thermopads are used where it is not possible to use thermally conductive paste. They are very flexible. They are characterized by high compressibility which ensures a good fit to elements that require cooling. AG Termopasty ART.AGT-155

AG Double-sided adhesive, thermally conductive thermopads are used where it is not possible to use thermally conductive paste. They are very flexible. They are characterized by high compressibility which ensures a good fit to elements that require cooling. AG Termopasty ART.AGT-158

Educational kit for self-assembly. It allows you to build a movable model of the solar system

Lead-free solder paste ALPHA OM-338-CSP, no-clean type, based on SAC305 alloy, intended for SMT printing and assembly, is distinguished by high joint quality, resistance to solder ball and void formation, and compliance with IPC Class III standards. Ideal for manufacturing high-reliability devices.