Contact IPA plus 500ml, plastic bottle (WG)

Foam with a density of 0.99 g/cm3 and a slightly alkaline pH (7-8) helps to find any gas or air leaks. AG Termopasty ART.AGT-133

Contact IPA Plus contains high purity isopropyl alcohol. Removes all contamination from optical elements. Leaves no traces or stains. AG Termopasty ART.AGT-002

The lint-free cloth, made from a blend of cellulose and polyester, effectively cleans stencils of solder paste and adhesive residues without leaving any lint behind. The product is available in a roll of 40 pieces, each measuring 26.5 x 39 cm, and is recommended for use with a cleaner

Acetone is a versatile organic solvent with a strong effect, used in industry, cosmetics and home to dissolve many organic substances, including fats, resins and polymers, and its safe packaging guarantees long-term storage

The AG preparation enables intense, concentrated blowing to inaccessible places, removes dust from various elements, especially where wet cleaning or solvents can not be used, and total dedusting is required. AG Termopasty ART.AGT-229

PRF 6-68 is a specialized cleaning spray with a 520 ml capacity, designed for removing oxides, sulfides, and greasy contaminants from electrical and electronic contacts. Particularly recommended for corroded connections, it restores low contact resistance and minimizes voltage drops, ensuring reliable device operation.

SL-1006D polyester wipes, measuring 150x150 mm, are made of 100% polyester and feature high absorbency and low lint levels. They are designed for high-cleanliness applications, such as laboratories, the electronics industry, and the pharmaceutical sector. The package contains 150 wipes.

Compressed Air Flammable 800ml MICRO CHIP ELEKTRONIC ART.016

AG Thermopads without glue are used where it is not possible to use thermal paste. They are very flexible. They are characterized by high compressibility which ensures a good fit to elements that require cooling. They do not contain glue. AG Thermopaste ART.AGT-305

HPX thermally conductive silicone paste that improves heat transfer between electronic components and the heat sink, guaranteeing their proper operation. They effectively prevent punctures and protect against weather influences. AG Termopasty ART.AGT-114

AG Thermopads without glue are used where it is not possible to use thermal paste. They are very flexible. They are characterized by high compressibility which ensures a good fit to elements that require cooling. They do not contain glue. AG Thermopaste ART.AGT-299

Two-component silicone filler for filling or filling gaps in heat-generating electronic components with metal housings or heat sinks. AG Termopasty ART.AGT-263

TIP TINNER TSLF+ is an indispensable product for anyone working with soldering, offering a quick and effective solution to problems with oxidized tips. Thanks to its advanced formula and compliance with current standards, it is a high-class product that will significantly improve the efficiency and quality of soldered joints.

Non-toxic, odorless, colorless. Neutral in contact with plastics. The consistency of the preparation allows a wide range of applications. A small amount is enough to cover a few square centimeters. MICRO CHIP ELEKTRONIC ART.178

Olive oil for lightly loaded parts of industrial machinery and equipment. AG Termopasty ART.AGT-080