Contact IPA plus 1l, metal canister

A professional solution for cleaning printed circuit boards, especially soldering residues. Provides excellent cleanliness of circuit boards. MICRO CHIP ELEKTRONIC ART. 205

A professional solution for cleaning printed circuit boards, especially soldering residues. Provides excellent cleanliness of circuit boards. MICRO CHIP ELEKTRONIC ART.206

A professional solution for cleaning printed circuit boards, especially soldering residues. Provides excellent cleanliness of circuit boards. MICRO CHIP ELEKTRONIC ART.207

Professional, aqueous, non-flammable liquid for handling printed circuit boards in ultrasonic cleaners. Removes suitable applications after soldering. Perfect for flooding not only with diluted liquids. MICRO CHIP ELEKTRONIC ART. 236

Professional, aqueous, non-flammable liquid for handling printed circuit boards in ultrasonic cleaners. Removes suitable applications after soldering. Perfect for flooding not only with diluted liquids. MICRO CHIP ELEKTRONIC ART.237

Professional, aqueous, non-flammable liquid for handling printed circuit boards in ultrasonic cleaners. Removes suitable applications after soldering. Perfect for flooding not only with diluted liquids. MICRO CHIP ELEKTRONIC ART.238

Service set 3x600ml. MICRO CHIP ELEKTRONIC ART.320

A professional solution for cleaning printed circuit boards, especially soldering residues. Provides excellent cleanliness of circuit boards. MICRO CHIP ELEKTRONIC ART.200

Wipes soaked in isopropyl alcohol. They perfectly remove all impurities from optical elements and electronic devices. 25 pcs. AG Termopasty ART.AGT-181

Varnish intended for repairing graphite-coated tiles, e.g. in remotes and calculators. It will also work well for shorting bridges and repairing broken paths. AG Termopasty ART.AGT-022

Silicone-free separator for molds used in the processing of plastics (injection, vacuum forming, production of laminates). AG Termopasty ART.AGT-228

Two-component resin for potting and encapsulating components in electronics, incl. for making castings and filling to protect electrotechnical elements. AG Termopasty ART.AGT-223

Two-component resin for potting and encapsulating components in electronics, incl. for making castings and filling to protect electrotechnical elements. AG Termopasty ART.AGT-224

Two-component silicone cross-linking filler in the addition system. The filler perfectly protects the electronics against unfavorable environmental factors and protects the sensitive modules against vibrations. AG Termopasty ART.AGT-222

Two-component silicone filler for filling or filling gaps in heat-generating electronic components with metal housings or heat sinks. AG Termopasty ART.AGT-219

Two-component silicone filler for filling or filling gaps in heat-generating electronic components with metal housings or heat sinks. AG Termopasty ART.AGT-201