FPGA Cloud Connectivity Kit - set with TerasIC DE10-Nano and WiFi module
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  • FPGA Cloud Connectivity Kit - set with TerasIC DE10-Nano and WiFi module
  • FPGA Cloud Connectivity Kit - set with TerasIC DE10-Nano and WiFi module
ID: 588050
zł1,674.53
Tax included

zł1,361.41 tax excl.

Set with FPGA Terasic DE10-Nano board and WiFi module. Designed for projects using FPGA to work in the cloud. TerasIC P0700

6 weeks
On request

 

Free shipping

free shipping in Poland for all orders over 500 PLN

 

Same day shipping

If your payment will be credited to our account by 11:00

 

14 days for return

Each consumer can return the purchased goods within 14 days

Description

A set with a Terasic DE10-Nano FPGA board and a Bluetooth and WiFi module designed for projects using FPGA to work in the cloud. It helps to develop an FPGA-based application that can collect, analyze and respond to data from IoT devices. The kit is certified by key cloud service providers (CSPs) such as Microsoft Azure and includes examples of open source projects that will walk users through the process of connecting an FPGA-based device to the cloud.

The FPGA Cloud Connectivity Kit is based on the Terasic DE10-Nano. This is a development board with Cyclone® V SE 5CSEBA6U23I7. It includes a programmable FPGA chip with 110,000 logic elements and a processor based on the ARM Cortex-A9 architecture with a frequency of 800 MHz. The board, thanks to many components, such as numerous LEDs, monostable buttons, slide switches, USB-Blaster, SDRAM, accelerometer, HDMI output and digital input and output strip, is an ideal tool for learning FPGA programming. The board is also perfect for prototyping projects related to this topic.

The set includes a board with Wi-Fi and Bluetooth wireless communication, as well as a wide range of sensors, such as ambient light sensors, temperature and humidity sensors, an accelerometer and a gyroscope.

Attention!

The RFS board in the FCC-WiFi version does not have a built-in Bluetooth HC-05 module. The version with the BT module is available at website.

The FPGA Cloud Connectivity Kit allows users to incorporate a flexible and reconfigurable FPGA chip into an IoT project.

Features

TerasIC DE10-Nano

  • FPGA Device

    • Intel Cyclone® V SE 5CSEBA6U23I7 device (110K LEs)
    • Serial configuration device – EPCS128
    • USB-Blaster II onboard for programming; JTAG Mode
    • HDMI TX, compatible with DVI 1.0 and HDCP v1.4
    • 2 push-buttons
    • 4 slide switches
    • 8 green user LEDs
    • Three 50MHz clock sources from the clock generator
    • Two 40-pin expansion headers
    • One Arduino expansion header (Uno R3 compatibility), can be connected with Arduino shields
    • One 10-pin Analog input expansion header (shared with Arduino Analog input)
    • A/D converter, 4-pin SPI interface with FPGA
  • HPS (Hard Processor System)
    • 800MHz Dual-core ARM Cortex-A9 processor
    • 1GB DDR3 SDRAM (32-bit data bus)
    • 1 Gigabit Ethernet PHY with RJ45 connector
    • USB OTG Port, USB Micro-AB connector
    • Micro SD card socket
    • Accelerometer (I2C interface + interrupt)
    • UART to USB, USB Mini-B connector
    • Warm reset button and cold reset button
    • One user button and one user LED
    • LTC 2x7 expansion header
  • Size: 68.6x107mm

RFS

  • Wi-Fi, using ESP-WROOM-02 module, up to 100 meter range
  • 9-axis sensor: accelerometer,gyroscope,magnetometer
  • Ambient light sensor
  • Humidity and temperature sensor
  • UART to USB
  • 2x6 TMD GPIO Header

Kit contains

  • Quick Start Guide
  • DE10-Nano Board
  • RFS Daughter Card
  • 40-Pin IDC To Box Header Cable
  • Type A to Mini-B USB Cable x1
  • Type A to Micro-B USB Cable x1
  • Power DC Adapter (5V)
  • microSD card (installed)
  • Four Silicon Footstands
588050

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