MX-5566-10A is a 10-position wafer socker from the Mini-Fit Jr. series by Molex designed for reliable power connections. Its 4.2 mm pitch, high current capability, and robust design make it widely used in computer power supplies, industrial electronics, and power distribution applications.

The MX-5569-12 socket is a 12-pin, right-angle compactible with Mini-Fit Jr. connector with a 4.2 mm pitch, designed for wire-to-board mounting. Engineered for reliable power and signal transmission, it is commonly used in industrial equipment, computer systems, and power supply applications.

Quartz resonator 25 MHz, housing HC49S (low), RoHS

Black pressed heat sink made of aluminum. It has dimensions of 25x20.5x7 mm, intended for TO220 package. FK220SA220

The FK214 series heat sink is a high-quality component for heat dissipation from electronic circuits in TO-220, SOT-32 and DS packages, with a thermal resistance of 15K/W. Its compact size and easy installation make it ideal for applications requiring reliable cooling, such as power supplies and voltage regulators.

Andrzej Pawluczuk

Henryk Wieczorek

ARM7TDMI, 32kB Flash (ISP), 8kB RAM, USB 2.0, ADC, 2xUART, 2xI2C, SPI, LQFP64, RoHS