Category: Soldering chemistry
The Kamami store offers soldering pastes, rosins and other fluxes facilitating the soldering of elements for through-hole and surface SMD assembly.
Subcategories
There are 52 products.
AG 50 soldering acid with a brush. The product is intended for soldering of nickel plated surfaces. AG Termopasty ART.AGT-319
Thickened rosin flux intended for SMT assembly and repair. In a 10 ml cartridge. AG Termopasty ART.AGT-179
RF800 flux is a medium-active rosin solution that does not require washing. AG Termopasty ART.AGT-042
Flux gel is a thickened rosin flux class RMA designed for SMT assembly and repairs. AG Termopasty ART.AGT-088
Rosin flux in a 100 ml plastic bottle with a brush. AG Termopasty ART.AGT-109
AG 50 soldering acid with a brush. The product is intended for soldering of nickel plated surfaces. AG Termopasty ART.AGT-253
Aerosol varnish to protect printed circuit boards against oxidation. AG Termopasty ART.AGT-235
Gel rosin flux designed for assembly and repair of THT and SMT components. Cartridge with a capacity of 10 ml. RMA-223
A liquid, chloride-free flux intended for mechanized soldering of printed circuit boards on a double wave of the binder in surface mounting. 100 ml bottle. AG Termopasty ART.AGT-041
The fluid is intended for soft soldering of galvanized sheets and pure zinc. 100 ml bottle. AG Termopasty ART.AGT-205
Liquid, rosin-free flux intended for soldering elements made of steel and chrome-nickel alloys. 100 ml bottle. AG Thermopasty ART.AGT-046
Paste flux intended for soft soldering of metals. 40 ml package. AG Termopasty ART.AGT-203
Liquid flux in the form of a rosin solution with the addition of organic activators, in a 10 ml marker. Kester 186
Gel flux is a thickened RMA class rosin flux intended for SMT assembly and repairs. AG Termopasty ART.AGT-089
The fluid is intended for soft soldering of galvanized sheets and pure zinc. 50 ml bottle. AG Termopasty ART.AGT-204
Flux intended for soldering and welding with brass solders. Dissolves metal oxides and facilitates the bonding of solder to the material. AG Borax ART. AGT-121
Rosin flux in a 1000 ml plastic bottle. AG Termopasty ART.AGT-043
A rosin-free, liquid flux intended for the application of the liquid Sn60/Pb alloy on printed circuit boards in tinplate rollers. 100 ml bottle. AG Termopasty ART.AGT-110
A liquid, chloride-free flux intended for mechanized soldering of printed circuit boards on a double wave of the binder in surface mounting. 1000 ml bottle. AG Termopasty ART.AGT-074
Liquid flux in the form of a rosin solution with the addition of organic activators, in a bottle with a capacity of 1000 ml. AG Termopasty ART.AGT-076