Unleaded soldering

Authors: Halina Hackiewicz, Krystyna Bukat

ISBN: 978-83-60233-25-2
Format: B5, 398 pages
Hardcover
BTC publishing house
Legionowo 2007

About the book

Unleaded soldering (assembly) technologies are still among the innovators in modern electronics, which together with limited access to competent Polish-language sources of information causes that they arouse much controversy among practitioners. Lack of comprehensive information on the parameters, possibilities and limitations of lead-free technologies can also have a negative impact on the durability and reliability of the electronic devices produced.
The book is the first comprehensive manual published in Polish, with elements of a review guide, intended for technologists and constructors of electronic devices, students of technical universities, as well as readers interested in modern trends occurring in modern electronics. It touched upon all issues relevant to the practice related to the broadly understood "lead-free technology".

About the authors

Dr inż. Krystyna Bukat is a graduate of the Faculty of Chemistry of the Warsaw University of Technology. She did her doctorate at the Institute of Organic Chemistry of the Polish Academy of Sciences in Warsaw. Since 1972, he has been researching materials for electronics, including soldering materials at the Tele and Radiotechnical Institute. For 10 years involved in the study of lead-free materials. He actively participates in national and international consortia for eco-friendly materials for electronics, propagation and implementation of the RoHS directive. Author and co-author of numerous scientific publications and patents. A member of PKN and International Microelectronics and Packaging Society (IMAPS, Poland and USA Chapters).

MSc. Halina Hackiewicz is a graduate of the Faculty of Chemistry of the Warsaw University of Technology, she worked at the Tele and Radiotechnical Institute from 1971 as an adjunct, currently retired. Her professional activity included primarily research and implementation work in the field of new technologies in electronic assembly. From 1990, she was a member of the research group, which was the first in the country to develop and implement the surface assembly technology at the ITR Board of Printed Tiles. In the years 1995 to 2000 she held the position of the head of the Assembly Technology Department, where surface assembly of electronic assemblies was commissioned by domestic and foreign manufacturers of electronic equipment and new technologies in the field of advanced assembly techniques were developed. Its activity is closely related to the creation of standards for the domestic industry in the field of surface mount technology. For many years he has been a member of the Assembly Assembly Technology Group of the Polish Standardization Committee which develops Polish standards for printed circuit boards and electronic assembly techniques. He is a member of IMAPS Polska. Alone and as a co-author, she published over 80 scientific articles in national and foreign magazines and in materials from national and international conferences in which she participated. She participated in targeted projects in cooperation with national industrial plants (ELDOS) and in international projects such as CENELIN, PRINT, GreenRose.

To download

• Table of Contents
• Chapter 1 from the book
• A review of the book that appeared in the Welding Institute Bulletin