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Flux TK83 is an alcohol solution for soldering with the addition of organic activators. AG Termopasty ART.AGT-044
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Flux TK83 is an alcohol solution for soldering with the addition of organic activators. Type 1.1.2/3 A flux according to ISO 9454-1 is suitable for hand tinning to restore solderability. This liquid, medium active formulation contains 24% whole parts and has a maximum application temperature of 280 degrees Celsius. Flux is applied to printed circuit boards in several ways. It can be a foam method, a flux wave, by immersion or with a brush. It does not require removal after use, which affects the convenience of use.
The most popular Sn60Pb40 SW26 solder is a high-quality lead product with SW26 flux, intended for professional soldering in electronics and electrical engineering, meeting the EN ISO 9453:2014 standard
Metal paste for spreading the paste, flux
Metal spatula for spreading a paste or flux. Allows even spreading of the flux.
Soldering rosin with the addition of activators, thanks to which it has an activity similar to solder paste. 500 g package. AG Termopasty ART.AGT-094
Kester 951 is a halogen-free, chlorophyll Flux Pen® applicator, specially designed for surface soldering.
Liquid flux in the form of a rosin solution with the addition of organic activators, in a bottle with a capacity of 500 ml. AG Termopasty ART.AGT-075
Liquid, rosin-free flux intended for high-temperature tinning and soldering of painted elements. 500 ml bottle. AG Termopasty ART.AGT-071
Flux gel is a thickened rosin flux class RMA designed for SMT assembly and repairs. AG Termopasty ART.AGT-047
The fluid is intended for soft soldering of galvanized sheets and pure zinc. 100 ml bottle. AG Termopasty ART.AGT-205
Liquid flux in the form of a rosin solution with the addition of organic activators, in a bottle with a capacity of 1000 ml. AG Termopasty ART.AGT-076
Thickened rosin flux intended for SMT assembly and repair. In a 10 ml cartridge. AG Termopasty ART.AGT-179
Soldering acid for soldering of non-nickel-plated nickel plated surfaces. AG Termopasty ART.AGT-117
Gel rosin flux designed for assembly and repair of THT and SMT components. Cartridge with a capacity of 10 ml. RMA-223
Aerosol varnish to protect printed circuit boards against oxidation. AG Termopasty ART.AGT-235
Liquid, rosin-free flux intended for soldering elements made of steel and chrome-nickel alloys. 500 ml bottle. AG Thermopasty ART.AGT-082
A liquid, chloride-free flux intended for mechanized soldering of printed circuit boards on a double wave of the binder in surface mounting. 1000 ml bottle. AG Termopasty ART.AGT-074
Soldering paste medium-active flux with the consistency of a paste based on rosin and organic halogen activator, facilitating the soldering of copper, silver, zinc and nickel elements. AG Termopasty ART.AGT-037
Soldering acid intended for hard-to-solder nickel-plated surfaces. 100 ml bottle. AG Termopasty ART.AGT-246
Soldering paste medium-active flux with the consistency of a paste based on rosin and organic halogen activator, facilitating the soldering of copper, silver, zinc and nickel elements. AG Termopasty ART.AGT-038
Flux TK83 is an alcohol solution for soldering with the addition of organic activators. AG Termopasty ART.AGT-044