Terasic Atum A5 Development Kit – development kit with Intel Agilex 5 FPGA

[EDUCATIONAL PRICE] FPGA starter kit equipped with Cyclone V GT with 301K LE and minicomputer with Intel Celeron Dual Core (64 GB eMMC, 4 GB RAM). The FPGA module has 1 GB DDR3 memory, 64 MB SDRAM memory, UART-USB interface and extensions such as GPIO and Arduino. Terasic P0650

FPGA starter kit equipped with Cyclone V GT with 301K LE and minicomputer with Intel Celeron Dual Core (64 GB eMMC, 4 GB RAM). The FPGA module has 1 GB DDR3 memory, 64 MB SDRAM memory, UART-USB interface and extensions such as GPIO and Arduino. Terasic P0650

Development platform based on Intel MAX 10 FPGA. The system provides the user with 50,000 logical elements and 1638 kbits M9K and 5888 kbits Flash. The board contains components such as embedded USB-Blaster II, QSPI Flash, ADC connector, WS2812B RGB LED and 2x6 TMD connector. TerasiC T-Core P0633

Development platform based on Intel MAX 10 FPGA. The system provides the user with 50,000 logical elements and 1638 kbits M9K and 5888 kbits Flash. The board contains components such as built-in USB-Blaster II, QSPI Flash, ADC connector, WS2812B RGB LED and 2x6 TMD connector. Academic version. TerasiC T-Core P0633

Compact FPGA kit with Intel Arria 10 GX chip equipped with 8 GB DDR4-2133 memory and Thunderbolt 3 communication connector. Can be used directly on laptops or other portable devices. Terasic FLIK P0642

Compact FPGA kit with Intel Arria 10 GX chip equipped with 8 GB DDR4-2133 memory and Thunderbolt 3 communication connector. Can be used directly on laptops or other portable devices. Academic version. Terasic FLIK P0642

Evaluation module with Intel Stratix 10 SoC processor with 2800K logic elements. The module has DDR4 SDRAM memory (up to 64 GB), built-in USB-Blaster II, Ethernet, microSD, miniUSB and expandable FMC/FMC+ connectors. TerasIC Apollo S10 SoM Board (P0630)

Development kit with Apollo S10 module and base board. Equipped with an Intel Stratix 10 SoC processor with 2800K logic elements, has a DDR4 SDRAM memory (up to 64 GB), built-in USB-Blaster II, Ethernet, microSD, miniUSB and QSFP connectors and USB type C. TerasIC Apollo Developer Kit (P0671)

FPGA starter kit with Intel Stratix 10 SX chip. The module has integrated transceivers that transmit data at speeds up to 28.3 Gb/s, making DE10-Pro fully compatible with version 3.0 of the PCI Express standard. The DE10-Pro offers fast parallel Flash memory and four SO-DIMMs that have 4 GB DDR4 SDRAM. Terasic P0627

FPGA starter kit with Intel Stratix 10 SX chip. The module has integrated transceivers that transmit data at speeds up to 28.3 Gb/s, making DE10-Pro fully compatible with version 3.0 of the PCI Express standard. The DE10-Pro offers fast parallel Flash memory and four SO-DIMMs that have 8GB DDR4 SDRAM. Terasic P0629

Computation accelerator module based on Intel® Agilex ™ FPGA. It has a PCI Express Gen 4.0 x16 slot, two 200G QSFP-DD connectors, and offers 32GB DDR4. Terasic DE10-Agilex (P0701)

Set with FPGA Terasic DE10-Nano board and WiFi module. Designed for projects using FPGA to work in the cloud. TerasIC P0700

Evaluation board with the Intel Agilex SoC system with 1400 thousand. logical elements. The module has two DDR4 SO-DIMM memory slots (up to 32 GB), QSFP28 connector, PCIe Gen 4x16, built-in USB-Blaster II and FMC/FMC+ connectors for expansion. TerasIC Apollo Agilex SOM (P0714)

Terasic Atum A5 Development Kit – an advanced Intel Agilex 5 FPGA kit for AI, vision systems, and high-bandwidth applications. Terasic Atum A5 Development Kit

Evaluation board with an Intel Agilex SoC featuring 1.4 million logic elements. The module includes sockets with built-in 32 GB DDR4 SO-DIMM memory, a QSFP28 connector, PCIe Gen 4x16, an integrated USB-Blaster II, and FMC/FMC+ connectors for expansion. TerasIC Apollo Agilex SOM (P0795)

The Terasic DE25-Nano development board with Agilex™ 5 FPGA and ARM Cortex-A76/A55 HPS system is a modern platform for AI applications, vision processing, and embedded systems. A rich set of interfaces and memory, active cooling, and compact dimensions allow it to be used both in prototyping and in final industrial solutions.