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Thermal paste AG Extreme thanks to the use of steel dust additive ensures the discharge of large amounts of heat from electronic components (processors, graphics cards, power systems). 3g paste in a syringe. AG Termopasty ART.AGT-108
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Each consumer can return the purchased goods within 14 days
AG Extreme paste enables excellent heat conduction between elements such as: heat sink and fan, CPU, GPU. The substance is a dielectric (not an electrical conductor), which provides protection against various electrical hazards. The method of application ensures simplicity of use, and the product can be easily applied to various elements of computer equipment, LEDs. Application: fills micro unevenness between touching elements, e.g. processor and radiator, heat transfer from the condenser of the heat pipe to the exchanger in the vacuum solar collector, LED diodes.
Heat Grease Thermal Grease based on copper with a thermal conductivity of approx. 3.1 W / mK. AG Termopasty ART.AGT-060
AG Silver thermal grease with the addition of silver compounds with high thermal conductivity. 3g paste in a syringe. AG Termopasty ART.AGT-107
AG Gold is a thermal paste with the addition of gold. It is characterized by high thermal conductivity (>2.8 W/mK), which is up to three times higher than in the case of introducing products. AG Termopasty ART.AGT-163
AG Silver thermal grease with the addition of silver compounds with high thermal conductivity. 4g paste in a small bottle with a brush. AG Termopasty ART.AGT-124
No product available!
TO3 thermal conductive pads are characterized by high thermal conductivity (1.5 W/mK) and at the same time are an effective electrical insulator. They can be used with various types of transistors, improving their work. They do not contain glue. AG Thermopaste ART.AGT-240
AG Double-sided adhesive, thermally conductive thermopads are used where it is not possible to use thermally conductive paste. They are very flexible. They are characterized by high compressibility which ensures a good fit to elements that require cooling. AG Termopasty ART.AGT-157
No product available!
AG Double-sided adhesive, thermally conductive thermopads are used where it is not possible to use thermally conductive paste. They are very flexible. They are characterized by high compressibility which ensures a good fit to elements that require cooling. AG Termopasty ART.AGT-158
No product available!
The AG TermoGlue thermal adhesive is used to mount heat sinks on integrated circuits requiring cooling, and fills in unevenness to improve heat conduction. AG Termopasty ART.AGT-116
AG Gold is a thermal paste with the addition of gold. It is characterized by high thermal conductivity (>2.8 W/mK), which is up to three times higher than in the case of introducing products. AG Termopasty ART.AGT-163
Foam with a density of 0.99 g/cm3 and a slightly alkaline pH (7-8) helps to find any gas or air leaks. AG Termopasty ART.AGT-133
TO thermal conductive pads are characterized by high thermal conductivity (1.5 W/mK) and at the same time are an effective electrical insulator. They can be used with various types of transistors, improving their work. They do not contain glue. AG Thermopaste ART.AGT-243
AG Double-sided adhesive, thermally conductive thermopads are used where it is not possible to use thermally conductive paste. They are very flexible. They are characterized by high compressibility which ensures a good fit to elements that require cooling. AG Termopasty ART.AGT-156
No product available!
TO220 thermal conductive pads are characterized by high thermal conductivity (1.5 W/mK) and at the same time are an effective electrical insulator. They can be used with various types of transistors, improving their work. They do not contain glue. AG Thermopaste ART.AGT-241
AG Double-sided adhesive, thermally conductive thermopads are used where it is not possible to use thermally conductive paste. They are very flexible. They are characterized by high compressibility which ensures a good fit to elements that require cooling. AG Termopasty ART.AGT-195
No product available!
Thermal paste AG Extreme thanks to the use of steel dust additive ensures the discharge of large amounts of heat from electronic components (processors, graphics cards, power systems). A paste weighing 1000g in a plastic box. AG Termopasty ART.AGT-150
No product available!
AG Gold is a thermal paste with the addition of gold. It has an exceptionally high thermal conductivity (>2.8 W/mK), which is up to three times higher than most traditional products. 3g paste in a syringe. AG Termopasty ART.AGT-106
AG Thermopads without glue are used where it is not possible to use thermal paste. They are very flexible. They are characterized by high compressibility which ensures a good fit to elements that require cooling. They do not contain glue. AG Thermopaste ART.AGT-292
No product available!
Thermally conductive silicone paste H improve the heat flow between electronic components and the heatsink, guaranteeing their proper operation. AG Termopasty ART.AGT-120
No product available!
HP thermally conductive silicone paste that improves heat transfer between electronic components and the heat sink, guaranteeing their proper operation. They effectively prevent punctures and protect against weather influences. AG Termopasty ART.AGT-113
AG Double-sided adhesive, thermally conductive thermopads are used where it is not possible to use thermally conductive paste. They are very flexible. They are characterized by high compressibility which ensures a good fit to elements that require cooling. AG Termopasty ART.AGT-138
Thermal paste AG Extreme thanks to the use of steel dust additive ensures the discharge of large amounts of heat from electronic components (processors, graphics cards, power systems). 3g paste in a syringe. AG Termopasty ART.AGT-108