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Handbook of Silicon Wafer Cleaning Technology, 2nd Edition
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  • Handbook of Silicon Wafer Cleaning Technology, 2nd Edition
ID: 172771
Karen Reinhardt, Werner Kern
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The second Edition of the Handbook of Silicon The Wafer Cleaning Technology is intended for the production of integrated circuits. The integration of the process of production, as well as the thermal, implant, etching, and photolithography processes. The Handbook discusses both wet and plasma-based cleaning technologies that are used for contamination, particles, residue, and photoresist from wafer surfaces. Both the process and the equipment are covered. A review of the current cleaning technologies is included. Also, advanced cleaning technologies that are under investigation; including supercritical fluid, laser, and cryoaerosol cleaning techniques. The theoretical aspects of the cleaning and the damage to the surface of the wafer. The analysis of the wafers surface is outlined. A discussion of the requirements of the plant.

• Focused on silicon wafer cleaning techniques, including wet, plasma, and other surface conditioning techniques.

• As this book covers the major technologies for the semiconductor and microelectronics industries.

• Covers processes and equipment, as well as requirements for the surface conditioning process.

• Editors are both of the top names and are both extensively published.

• Discusses next generation processing techniques, including supercritical fluid, laser, and cryoaerosol.

Part 1: Introduction and Overview
Overview and Evolution of Silicon Wafer Cleaning Technology
Overview of Wafer Contamination and Defectivity
Part 2: Wet-Chemical Processes
Particle Deposition and Adhesion
Aqueous Cleaning and Surface Conditioning Processes
Part 3: Dry Cleaning Processes
Gas-phase Wafer Cleaning Technology
Plasma Stripping and Cleaning
Cryogenic Aerosols and Supercritical Fluid Cleaning
Part 4: Analytical and Control Aspects
Detection and Measurement of Particulate Contaminants
Surface Chemical Composition and Morphology
Ultratrace Impurity and Surface Morphology Analysis
Analysis and Control of Electrically Active Contaminants
Part 5: Directions for the Near Future
172771

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