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The use of LTCC ceramics in microelectronics
ID: 60144
Leszek Golonka
The book informs about the basics, manufacturing processes and possibilities of LTCC technology. Several specific structural and technological solutions for LTCC structures have been presented, applicable in very different fields.
In general, MCM technologies (MCM-D, MCM-L, MCM-C) have been described, in detail, the thick-film technology (which is the basic technique used to produce conductive paths and electronic components in the LTCC module) and technology and design of LTCC modules.
The main directions of applications of LTCC technology are presented. In addition to typical applications (such as: VLSI integrated circuits, microwave circuits and multi-structured integrated circuits (MCIC)), the design and operating principle of various sensors and microsystems made in LTCC technique are described. There is also a detailed description of cooling, heating and temperature analyzing systems as well as plasma displays.
Table of Contents
acronyms
1. Introduction
2. MCM multistructure modules
2.1. MCM-D type modules
2.2. MCM-L modules
2.3. MCM-C modules
3. Thick film technology
3.1. General information
3.2. Production steps
4. Technology and design of LTCC modules
4.1. materials
4.2. Technological processes
4.3. Properties of LTCC modules
4.4. Design
5. LTCC applications
5.1. microwaves
5.2. Multi-structure integrated circuits (MCIC)
5.3. Sensors, microsystems
5.4. Cooling, heating and analyzing temperature distribution
5.5. Housings of MEMS systems
5.6. Plasma displays
6. Termination
Literature.
In general, MCM technologies (MCM-D, MCM-L, MCM-C) have been described, in detail, the thick-film technology (which is the basic technique used to produce conductive paths and electronic components in the LTCC module) and technology and design of LTCC modules.
The main directions of applications of LTCC technology are presented. In addition to typical applications (such as: VLSI integrated circuits, microwave circuits and multi-structured integrated circuits (MCIC)), the design and operating principle of various sensors and microsystems made in LTCC technique are described. There is also a detailed description of cooling, heating and temperature analyzing systems as well as plasma displays.
Table of Contents
acronyms
1. Introduction
2. MCM multistructure modules
2.1. MCM-D type modules
2.2. MCM-L modules
2.3. MCM-C modules
3. Thick film technology
3.1. General information
3.2. Production steps
4. Technology and design of LTCC modules
4.1. materials
4.2. Technological processes
4.3. Properties of LTCC modules
4.4. Design
5. LTCC applications
5.1. microwaves
5.2. Multi-structure integrated circuits (MCIC)
5.3. Sensors, microsystems
5.4. Cooling, heating and analyzing temperature distribution
5.5. Housings of MEMS systems
5.6. Plasma displays
6. Termination
Literature.
60144
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Leszek Golonka