Main view
search
  • Main view
  • Top view
  • Bottom view
ID: 1189196
zł519.00
Tax included

zł421.95 tax excl.

A compact module designed for quick integration of IoT capabilities using a cellular network. It offers LTE-M and NB-IoT standards and a range of MicroPython programming resources, the intuitive XBee Studio tool and Digi Remote Manager, enabling remote software updates and monitoring. SparkFun WRL-22329

6 weeks
On request
Kamami is the official distributor of Sparkfun modules and development kits. All products of this brand in our offer are original and come directly from the manufacturer.

 

Free shipping

free shipping in Poland for all orders over 500 PLN

 

Same day shipping

If your payment will be credited to our account by 11:00

 

14 days for return

Each consumer can return the purchased goods within 14 days

Description

The Digi XBee 3 module is a modern, compact solution designed for quick integration of IoT capabilities using a cellular network. It is equipped with cellular and BLE connectivity and was created to enable the creation of secure wireless devices with global access and positioning capabilities. Combining the XBee ecosystem with cellular functionality creates a simple system for working with data via a cellular connection.

LTE-M and NB-IoT cellular standards are optimized for low energy consumption and transmitting small amounts of data, such as asset tracking or smart sensors (less than 5 MB of data per month). A global connection is instantly available with Digi XBee 3 global cellular. This module offers an excellent power saving mode, extending battery life and operating time. It does not come with a SIM card. To make IoT development easier, the XBee 3 suite includes a range of MicroPython development resources, the intuitive XBee Studio tool, and a 12-month Digi Remote Manager subscription for each module, enabling remote software updates and monitoring. Digi XBee Studio, a powerful tool designed to accelerate development, production and deployment, further facilitates IoT deployment in cellular networks.

Features

  • Chipset: Telit ME310G1-WW
  • Data interface: UART, SPI, USB
  • Operating modes (LTE-M): transparent and API via serial port, PPP via USB
  • Operating modes (NB-IoT): transparent, API, UDP
  • Digi TrustFence® security with secure boot and protected JTAG
  • Configuration tools: Digi XBee Studio® (local), Digi Remote Manager® (OTA)
  • MicroPython with 1024 kB flash / 64 kB RAM
  • I/O: 4 ADC lines (10-bit), 13 digital I/O, USB, I2C
  • Bluetooth Low Energy
  • Characteristics of the cellular module:
    • Transmit power: up to 23 dBm (LTE-M/NB-IoT), up to 33 dBm (2G)
    • Reception sensitivity (LTE-M): −105 dBm
    • Reception sensitivity (NB-IoT): −113 dBm
    • Supported bands: LTE bands B1, B2, B3, B4, B5, B8, B12, B13, B18, B19, B20, B25, B26, B27, B28, B66, B71, B85; 2G bands B2, B3, B5, B8
    • Link speeds (LTE-M): up to 588 kbps (download), up to 1 Mbps (upload)
    • Link speeds (NB-IoT): up to 120 kbps (download), up to 160 kbps (upload)
    • Link speeds (2G): up to 264 kbps (download), up to 210 kbps (upload)
    • Duplex mode: half duplex
  • Connector: 20-pin Digi XBee
  • U.FL cellular antenna, U.FL Bluetooth, U.FL GNSS
  • SIM card size: 4FF Nano
  • Supply voltage: 3.3 to 4.3 V
  • Max. transmission current: 550 mA with Bluetooth turned off; 610 mA with Bluetooth enabled
  • Average transmission current (LTE-M): max. 1.25 A, average 410 mA (GM2 modules)
  • Average transmission current (NB-IoT): max. 1.3 A, average 410 mA (GM2 modules)
  • Average transmission current (2G): max. 2.1 A, average 320 mA (GM2 modules)
  • Power saving mode: 20 μA
  • Operating temperature: -40°C to 85°C
  • Dimensions: 24.38 x 32.94 mm
1189196

You might also like

Other products in the same category (16)