New products

This current probe is designed for measuring DC and AC current in power electronics systems and switching power supplies. It offers a 5 MHz DC bandwidth, a rise time of ≤ 70 ns, and two measurement ranges: 50 A and 300 A RMS, with a maximum peak current of up to 500 A. The device provides high measurement accuracy of ±1% and a resolution of up to 10 mA in the lower range. The BNC connector ensures compatibility with many oscilloscopes, and the 20 mm jaws enable current measurements in larger wires. Micsig CP3005

This current probe is designed for measuring DC and AC current in power electronics systems and switching power supplies. It offers a 10 MHz DC bandwidth, a rise time of ≤ 46 ns, and two measurement ranges: 30 A and 150 A RMS, with a maximum peak current of up to 300 A. The device provides high measurement accuracy of ±1% and a resolution of up to 10 mA in the lower range. The BNC connector ensures compatibility with many oscilloscopes, and the 20 mm jaws enable current measurements in larger wires. Micsig CP1510

A 16MP camera module designed for machine vision systems based on the Raspberry Pi and NVIDIA Jetson platforms. The Sony IMX519 CMOS sensor and PDAF + CDAF hybrid autofocus ensure fast, precise focusing and highly detailed images. The camera supports video recording up to 4K (3840 × 2160) and 1080p at 60 fps, and communication is via the MIPI CSI-2 interface. ArduCAM B0500C

The Edge AI camera is designed for computer vision and real-time image analysis applications. It features a 12.3MP Sony IMX500 sensor with built-in AI processing, enabling local execution of tasks like object detection, classification, and image segmentation without the need for a cloud connection. The camera communicates via USB 3.2 Gen 1 with a USB-C connector and supports the UVC standard, ensuring plug-and-play operation on Windows and Linux systems. ArduCAM B0566

An image processing kit using Edge AI technology. The device combines a camera with a 12.3MP Sony IMX500 sensor and a Raspberry Pi Compute Module 5 with a Broadcom BCM2712 processor, 4GB RAM, and 16GB eMMC. Built-in AI processing allows image analysis to occur directly on the device, reducing latency and eliminating the need to upload data to the cloud. The kit supports power supply via USB-C or PoE and is suitable for computer vision, surveillance, robotics, and IoT projects. ArduCAM B0601

A camera module designed for Raspberry Pi-based machine vision systems. It utilizes a 1.58MP monochrome Sony IMX296 sensor with Global Shutter technology, capturing 1440 x 1080 video at 60 fps without motion distortion. The camera features an M12 lens with a wide 96° field of view and supports the MIPI CSI-2 interface. The module is compatible with libcamera and Picamera2 tools and supports multiple Raspberry Pi models, including the Raspberry Pi 5, 4, 3, and Zero. ArduCAM B0619

This camera is designed for NVIDIA Jetson-based vision systems, including Orin Nano, Orin NX, and AGX Orin. It utilizes a 3MP Sony ISX031 sensor with 120dB HDR and an ISP (In-Depth Image Processor) for image transmission while receiving. The camera supports resolutions up to 1920 x 1536 at 60 fps and communicates via a fast MIPI CSI-2 interface with four transmission lines. It also features a wide-angle M12 lens and LED Flicker Mitigation technology for emergency operation in clinical settings. ArduCAM B0623

This USB industrial camera with a monochrome Global Shutter sensor is designed to capture high-speed, distortion-free motion. The camera offers 640 x 480 VGA resolution and captures up to 800 frames per second at 160 x 120 resolution. A wide-angle lens with a 166° field of view allows for large-area observation, while a built-in ISP image processor ensures real-time image processing. The device operates in the USB2 UVC standard and is compatible with Windows and Linux systems. ArduCAM B0632

A USB camera with a color Global Shutter sensor, designed to capture fast-moving objects without image distortion. The device offers 640 × 480 VGA resolution and recording up to 160 frames per second at lower resolutions. A built-in ISP image processor provides real-time image processing, and a wide-angle lens with a field of view of up to 166° allows for observation of a large area. ArduCAM B0633

Metal heatsink designed for the Arducam qb IMX500 AI Camera All-in-one Kit. Provides passive heat dissipation from the camera module and improves system stability during intensive AI processing. ArduCam U6298-B

Industrial IoT gateway and edge controller based on the Raspberry Pi Compute Module 4 with a quad-core 1.5 GHz Cortex-A72 processor, 4 GB RAM, and 32 GB of eMMC memory. The device supports LoRaWAN v1.1.0 communication in the EU868 band using the SX1302 chip and eight transmission channels, enabling the construction of large-scale IoT networks. It is equipped with numerous industrial interfaces, including three isolated RS485 ports, two Ethernet ports with PoE support, USB, HDMI, a SIM slot, and an M.2 slot. A fanless design with an IP40 enclosure, a hardware watchdog, a supercapacitor UPS module, and TPM 2.0 and ATECC608A security chips ensure high reliability in industrial applications and automation systems. Seeed Studio 100006298

A LoRa communication device designed for off-grid networks and long-range communication systems. The module is based on the nRF52840 microcontroller and the SX1262 radio chip operating in the 862–930 MHz band and offers additional Bluetooth 5.0 connectivity for smartphone communication. The device is equipped with an L76K GPS module supporting GPS, BeiDou, GLONASS, and QZSS systems, and a 1.3" OLED display for information presentation. A built-in 2000 mAh battery, USB-C charging, and the ability to be powered by a solar panel enable long-term operation in field applications and IoT systems. Seeed Studio 100030144

Industrial IoT gateway and edge controller based on the Raspberry Pi Compute Module 4 with a quad-core 1.5 GHz Cortex-A72 processor, 4 GB RAM, and 32 GB of eMMC memory. The device supports LoRaWAN v1.1.0 communication in the EU868 band using the SX1302 chip and eight transmission channels, enabling the construction of large-scale IoT networks. It is equipped with numerous industrial interfaces, including three isolated RS485 ports, two Ethernet ports with PoE support, USB, HDMI, a SIM slot, and an M.2 socket. A fanless design with an IP40 enclosure, a hardware watchdog, a supercapacitor UPS module, and TPM 2.0 and ATECC608A security chips ensure high reliability in industrial applications and automation systems. Seeed Studio 100079154

Bambu Lab ABS filament in silver is a durable 3D printing material designed for producing parts with high mechanical and thermal resistance. Thanks to its good dimensional stability and chemical resistance, it is well suited for printing functional prototypes, enclosures, and mechanical components that require strength and rigidity

PA11 filament with carbon fiber reinforcement, 1,75 mm diameter and 800 g net weight, offering increased stiffness, wear resistance and dimensional stability of printed parts. Designed for technical applications requiring high mechanical, chemical and thermal resistance. Spool equipped with NFC OpenPrintTag for automatic material recognition in compatible 3D printers. Prusa Research

3D printer nozzle compatible with the Nextruder system with a 0.4 mm diameter, equipped with a polycrystalline diamond (PCD) tip providing exceptional wear resistance. Designed for printing 1.75 mm filaments, including fiber-, metal-, and ceramic-filled materials

3D printer nozzle in the V6 standard with a 0.4 mm diameter, made of hardened tool steel with a nickel coating and WS2 layer reducing material adhesion. Designed for printing 1.75 mm filaments, especially abrasive materials and those requiring higher printing temperatures. Prusa Nozzle X E3D V6 0.4 mm

A specialized filament based on PEI 1010 (Polyetherimide / Ultem) with a diameter of 1.75 mm and a net weight of 500 g, designed for the most demanding industrial applications. The material is manufactured by Prusa Research with a guaranteed diameter tolerance of ±0.05 mm. This filament features very high thermal and chemical resistance, an excellent strength-to-weight ratio, and natural flame resistance. The spool is equipped with an NFC OpenPrintTag, allowing storage and reading of material data in compatible 3D printing systems. Prusa Research

A specialized filament based on polycarbonate (PC) with carbon additives, designed for applications requiring ESD properties and very low outgassing. The material has a diameter of 1.75 mm and a net weight of 850 g, manufactured by Prusa Research with a guaranteed diameter tolerance of ±0.04 mm. This filament is intended for technical applications including space-related projects, electronics enclosures, and advanced engineering prototypes. The spool is equipped with an NFC OpenPrintTag, allowing automatic material recognition in compatible 3D printers. Prusa Research

APDS9999 sensor module enabling measurement of light intensity (lux), RGB color, and infrared proximity detection. Communication via the I2C interface, while STEMMA QT / Qwiic connectors allow quick integration with prototyping systems. Adafruit 6461