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There are 22486 products.
Programmable Logic IC Development Tools Cyclone V SE 5CSEMA4U23C6N + 800MHz Dual-core ARM Cortex-A9 processor. Terasic P0496
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Development kit with nRF52832 microcontroller with ARM Cortex M4F core. Equipped with 512KB Flash and 64KB SRAM, it can support Bluetooth (BLE) communication. Adafruit 3406
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AG Double-sided adhesive, thermally conductive thermopads are used where it is not possible to use thermally conductive paste. They are very flexible. They are characterized by high compressibility which ensures a good fit to elements that require cooling. AG Termopasty ART.AGT-141
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AG Thermopads without glue are used where it is not possible to use thermal paste. They are very flexible. They are characterized by high compressibility which ensures a good fit to elements that require cooling. They do not contain glue. AG Thermopaste ART.AGT-293
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AG Thermopads without glue are used where it is not possible to use thermal paste. They are very flexible. They are characterized by high compressibility which ensures a good fit to elements that require cooling. They do not contain glue. AG Thermopaste ART.AGT-296
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AG Thermopads without glue are used where it is not possible to use thermal paste. They are very flexible. They are characterized by high compressibility which ensures a good fit to elements that require cooling. They do not contain glue. AG Thermopaste ART.AGT-299
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STM32F723E-DISCO Discovery kit allows users to develop applications with the microcontrollers of the STM32F7 Series, based on ARM®Cortex®-M7 core. The PMOD, STMod+ and Arduino™Uno V3 connectivity support provides unlimited expansion capabilities with a large choice of specialized add-on boards.
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AG Thermopads without glue are used where it is not possible to use thermal paste. They are very flexible. They are characterized by high compressibility which ensures a good fit to elements that require cooling. They do not contain glue. AG Thermopaste ART.AGT-302
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Module with 1.3 "OLED display with a resolution of 128 x 64 pixels, thanks to the SH1106 driver and communication via the I2C bus is an ideal solution to build a device with a spectacular appearance and reliable work
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N silicone paste with a density of 1.02-1.04 g/cm3 is a product characterized by protective properties. It preserves rubber in particular, as well as plastics, preventing punctures. AG Termopasty ART.AGT-054
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Thermally conductive silicone paste H improve the heat flow between electronic components and the heatsink, guaranteeing their proper operation. AG Termopasty ART.AGT-059
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Two-component resin for potting and encapsulating components in electronics, incl. for making castings and filling to protect electrotechnical elements. AG Termopasty ART.AGT-258
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AG Double-sided adhesive, thermally conductive thermopads are used where it is not possible to use thermally conductive paste. They are very flexible. They are characterized by high compressibility which ensures a good fit to elements that require cooling. AG Termopasty ART.AGT-197
No product available!
AG Double-sided adhesive, thermally conductive thermopads are used where it is not possible to use thermally conductive paste. They are very flexible. They are characterized by high compressibility which ensures a good fit to elements that require cooling. AG Termopasty ART.AGT-194
No product available!
AG Double-sided adhesive, thermally conductive thermopads are used where it is not possible to use thermally conductive paste. They are very flexible. They are characterized by high compressibility which ensures a good fit to elements that require cooling. AG Termopasty ART.AGT-191
No product available!
AG Double-sided adhesive, thermally conductive thermopads are used where it is not possible to use thermally conductive paste. They are very flexible. They are characterized by high compressibility which ensures a good fit to elements that require cooling. AG Termopasty ART.AGT-198
No product available!
AG Double-sided adhesive, thermally conductive thermopads are used where it is not possible to use thermally conductive paste. They are very flexible. They are characterized by high compressibility which ensures a good fit to elements that require cooling. AG Termopasty ART.AGT-195
No product available!
AG Double-sided adhesive, thermally conductive thermopads are used where it is not possible to use thermally conductive paste. They are very flexible. They are characterized by high compressibility which ensures a good fit to elements that require cooling. AG Termopasty ART.AGT-192
No product available!
Two-component resin for potting and encapsulating components in electronics, incl. for making castings and filling to protect electrotechnical elements. AG Termopasty ART.AGT-259
No product available!